Technology Forum

• 

FAQs

Can you give some examples of hybrid bonding techniques?

• Thermo-compression – solid-state application of force and temperature over time.
• Reflow – melting of contacts such as solder, indium.
• Thermo-adhesive – application of heat to cure an adhesive which holds an assembly together.
• UV adhesive - application of UV to cure an adhesive which holds an assembly together.
• Direct bonding of chips/wafers – thermo-compression of ultraflat, ultraclean substrates to each other to create VanDerWaals and/or cohesive bonding at the interface.
• Precision assembly of mechanical devices – micron-level control over the placement of components i.e.assembly of pieces of a MEMS device.
• Nano Imprint Lithography (NIL) – Impression of 3D patterns from a master die into a conformable surface to create a negative of the 3D pattern on a substrate.

Can you give some examples of materials/metallurgy?

• Indium-to-Indium
• Indium-to-contact metal (i.e. Nickel, Titanium, Molybdenum, Gold, etc.)
• Gold stud to gold pad
• Solders (i.e. SnAg, SAC, InAg, PbSn, AuSn, etc.)
• Copper-to-Copper
• Copper-to-solder
• Other contact metals such as Gallium, Aluminum, Tin, Lead, Silver, Bismuth, Molybdenum, Tantalum, Tungsten, Antimony, Zinc, and alloys thereof.
• Adhesives such as epoxy, SU-8, polyamide, acrylics, underfills, etc.

What types of bonding equipment are discussed here?

• High-accuracy, high-force
• High accuracy, low force
• Medium-to-high accuracy, high thruput
• SET FC150, FC300
• Amicra
• Finetech

What kinds of pre-bond surface treatment techniques would be discussed here?

• Solvent sprays such as Toluene, Acetone, Methanol, Isopropanol.
• Wet chemical treatments such as hydrochloric acid, citric acid, formic acid.
• Atmospheric vapor chemical treatments such as formic acid, forming gas.
• Vacuum plasma treatments such as ion milling, forming gas.
• Atmospheric plasma treatments such as the Ontos7
• Oxygen descum

What kind of post-bond diagnostic analysis can be done?

• Gap measurement and calculations for leveling
• Pull strength testing
• Shear strength testing
• Microscopic inspection of ruptured bonds (SEM, optical)
• Auger, ESCA, SIMS analysis of surfaces and interfaces
• Interferometric measurement of pre- and post-bond chip flatness.

Membership FAQs

Beyond the Membership fee, are their other costs involved in DAAHTA Membership?

The only additional cost is tooling. DAAHTA Members are expected to bring their own tooling or obtain tooling suited to their device characteristics.

Are DAAHTA's services available in smaller increments than offered in the membership levels, for a short process optimization project, or perhaps to help fill a demand spike?

Yes, DAAHTA would entertain a smaller project; contact us directly by any of the channels.

What about confidentiality? DAAHTA's "openness" seems in conflict with the confidentiality my project requires.

While it's true that we desire the tone of DAAHTA's culture to be a sharing one, we respect and will guard the confidentiality of any project. Members set the level of confidentiality they require, DAAHTA adheres to those requirements.