Equipment
>> LDP150: The Large Device Bonding Press
>> FC300: The High Force and High Accuracy Die Bonder for Large Devices
>> Device Bonding Applications
FC150 Flip Chip Bonders
DAATHA’s technology is built around use of SET FC150 Flip Chip Bonders (and the Suss systems of the same generation) these systems are respected world-wide for their true z-motion enabling sub 1um post bond accuracy. DAATHA sites feature FC150’s.
LDP150: The Large Device Bonding Press
FC300: The High Force and High Accuracy Die Bonder for Large Devices
Device Bonding Applications
IR-FPA Sensors