Equipment

>> FC150 Flip Chip Bonders

>> LDP150: The Large Device Bonding Press

>> FC300: The High Force and High Accuracy Die Bonder for Large Devices

>> Device Bonding Applications

 


 

FC150 Flip Chip Bonders

DAATHA’s technology is built around use of SET FC150 Flip Chip Bonders (and the Suss systems of the same generation) these systems are respected world-wide for their true z-motion enabling sub 1um post bond accuracy. DAATHA sites feature FC150’s.

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LDP150: The Large Device Bonding Press

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FC300: The High Force and High Accuracy Die Bonder for Large Devices

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Device Bonding Applications


IR-FPA Sensors

<< DAAHTA Site Locations and Information

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SET North America

SET's line of device bonders was formerly a division of SUSS MicroTec until its sale to SET management in 2007. SET North America (SETNA) was formed by several former employees of SUSS MicroTec to sell, service and support SET's device bonders. SETNA is the organizer and sponsor of DAAHTA and is also developing its own line of ancillary equipment to enhance device bonding.