>> LDP150: The Large Device Bonding Press
>> FC300: The High Force and High Accuracy Die Bonder for Large Devices
>> Device Bonding Applications
DAATHA’s technology is built around use of SET FC150 Flip Chip Bonders (and the Suss systems of the same generation) these systems are respected world-wide for their true z-motion enabling sub 1um post bond accuracy. DAATHA sites feature FC150’s.
IR-FPA Sensors
SET's line of device bonders was formerly a division of SUSS MicroTec until its sale to SET management in 2007. SET North America (SETNA) was formed by several former employees of SUSS MicroTec to sell, service and support SET's device bonders. SETNA is the organizer and sponsor of DAAHTA and is also developing its own line of ancillary equipment to enhance device bonding.