Semicon West, Tue-Thu July 8-10, 2014, Moscone Center, San Francisco, CA, Booth #6352
June 20, 2014
DAAHTA’s products now include “DAAHTA Daily” the opportunity to rent a FC150 for short term in a clean environment, for development work, process optimization, or pilot production.
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June 15, 2014
DAAHTA Opens new prototype and process development site in Ventura, California.
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Membership with DAAHTA grants you access to information, equipment, and a technology community. All membership levels include base benefits. DAAHTA also offers more access with Gold, Platinum, and Indium level memberships.
The Defense Aerospace Alliance for Hybridization Technology Advancement (DAAHTA) is a user alliance specifically geared toward the needs of the US Defense community to provide a forum to address and discuss technical issues in hybridization. Utilizing the experience of numerous industry experts and a network of partner sites, we offer users and prospective users hands-on use of SET's FC150 and FC300 Flip Chip bonders to develop or optimize bonding processes. DAAHTA members can interact with our own technical experts, other DAAHTA members, and a technology library to address issues surrounding hybridization. Plus, the annual Technology Summit will provide users a forum to interact with each other and with industry experts on cross-cutting technology and topics such as materials, process and metrology. DAAHTA members will also enjoy telephone access to our application experts during normal business hours. Membership in DAAHTA is available at several levels of involvement customized to the member's needs.
Share ideas and information with other users of flip chip bonding technology. Post process results and more.
DAAHTA offers three US sites to develop process and prototypes for defense and aerospace applications.
The Tech Library is a listing of technical papers, Conference Presentations, and articles that speak to hybridization techniques and challenges; they are listed with a short description to aid in your search.
SET's line of device bonders was formerly a division of SUSS MicroTec until its sale to SET management in 2007. SET North America (SETNA) was formed by several former employees of SUSS MicroTec to sell, service and support SET's device bonders. SETNA is the organizer and sponsor of DAAHTA and is also developing its own line of ancillary equipment to enhance device bonding.
