DAAHTA offers three US sites to develop process and prototypes for defense and aerospace applications.
2223 Eastman Ave. Ventura, CA 93003
Coming October 2011
SET's line of device bonders was formerly a division of SUSS MicroTec until its sale to SET management in 2007. SET North America (SETNA) was formed by several former employees of SUSS MicroTec to sell, service and support SET's device bonders. SETNA is the organizer and sponsor of DAAHTA and is also developing its own line of ancillary equipment to enhance device bonding.