John J. Callahan, Ph.D.
Dr. Callahan is Vice President of Engineering at SemiNex Corporation, a manufacturer of high-power long-wavelength semiconductor lasers. He is responsible for all technical programs including laser design, packaging and system development. Prior to joining SemiNex, Dr. Callahan was Director of Research and Development for Cubic Wafer where he led the efforts to develop a high density (3D-IC) packaging technology for the semiconductor industry. From 2002 to 2005, Dr. Callahan was with Xanoptix, Inc. While there, he served as the Director of Research and Development where he oversaw the IC, Mechanical and Processing Engineering teams. He was responsible for overseeing the development of a high density optical transceiver composed of multiple III-V optoelectronic devices directly bonded to a control ASIC and packaged with coupling optics.
Dr. Callahan earned his Ph.D. from the Georgia Institute of Technology and has multiple patents and publications in the areas of optoelectronic devices, hybridization and device processing.
SET's line of device bonders was formerly a division of SUSS MicroTec until its sale to SET management in 2007. SET North America (SETNA) was formed by several former employees of SUSS MicroTec to sell, service and support SET's device bonders. SETNA is the organizer and sponsor of DAAHTA and is also developing its own line of ancillary equipment to enhance device bonding.
