Semicon West, Tue-Thu July 8-10, 2014, Moscone Center, San Francisco, CA, Booth #6352
June 20, 2014
DAAHTA’s products now include “DAAHTA Daily” the opportunity to rent a FC150 for short term in a clean environment, for development work, process optimization, or pilot production.
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June 15, 2014
DAAHTA Opens new prototype and process development site in Ventura, California.
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Membership with DAAHTA grants you access to information, equipment, and a technology community. All membership levels include base benefits. DAAHTA also offers more access with Gold, Platinum, and Indium level memberships.
These things are brought together in three membership levels each with flexibility to meet invididual requirements.
DAAHTA introduces a uniquely different business model; traditionally equipment support has been parceled out in applications visits, service calls, maintenance contracts, all at your site on your system. DAAHTA is not a “plan” or “a call” but a membership, in which you choose the level of involvement that best suits your needs. DAATHA members are typically from the Defense and Aerospace segments, but any US-based company that does hybridization may be interested in DAAHTA’s competencies. DAAHTA’s Membership levels allow you to choose the involvement that offers the best value to your organization and even within membership levels there is flexibility of member benefits, all in a high-value membership.
>> Membership FAQs | >> Contact Us for More Information
Beyond the Membership fee, are their other costs involved in DAAHTA Membership?
The only additional cost is tooling. DAAHTA Members are expected to bring their own tooling or obtain tooling suited to their device characteristics.
Are DAAHTA's services available in smaller increments than offered in the membership levels, for a short process optimization project, or perhaps to help fill a demand spike?
Yes, DAAHTA would entertain a smaller project; contact us directly by any of the channels.
What about confidentiality? DAAHTA's "openness" seems in conflict with the confidentiality my project requires.
While it's true that we desire the tone of DAAHTA's culture to be a sharing one, we respect and will guard the confidentiality of any project. Members set the level of confidentiality they require, DAAHTA adheres to those requirements.
Matt Phillips | President/Founder
Matt Phillips has enjoyed serving in the Semiconductor industry for over 14 years, 10 of those years in marketing and sales with Suss MicroTech, from 1995-2005. In 2009 SET North America was formed; focusing on Sales, Marketing, applications and servicing of SET-SAS Die bonding equipment. SET-NA has enjoyed very good success representing the SET equipment line, has established the SET name in North America and have built strategic partnerships with in our market space. The SET-NA team has over 115 years of combined experience in the defense Aerospace industry. Our “technical knowhow” and more specifically our bonding process knowledge is foundational to establishing DAAHTA. DAAHTA has been formed to meet the high demands needed for the hybridization of IR/FPA sensors.
Eric Schulte | Chief Technology Officer
Eric Schulte has 36 years of experience as a semiconductor processing engineer: first for ten years at TexasInstruments Centeral Research Labs in Dallas, Tx; then nineteen years at Santa Barbara Research Center/Raytheon in Goleta, CA; and most recently, 7 years as a processing consultant to the likes of NASA Goddard, Teledyne, Lockheed Martin, DRS, Army Night Vision, HRL, SET-SAS, SETNA, and others.
Over the last 26 years, Eric has been instrumental in the advancement of hybrid bonding technology utilizing ultra high density indium bump interconnects in IRFPAs and MEMS devices, and holds numerous patents in this field. In addition to his work in bonding, Eric has developed numerous ancillary processes in the areas of liftoff lithography, Indium deposition, and pre-bond surface preparation of metallic contacts.
Eric holds Science degrees from Michigan Technological University and the University of Texas at Dallas. He resides in Santa Barbara, California.
Keith Cooper | Vice President of Technology & Development
Keith Cooper is responsible for technology and business development for SET-North America. Prior to joining SETNA, he worked for SUSS MicroTec, initially as a product and applications engineer for lithography tools, then in a variety of technical marketing and sales positions within the company. Before SUSS MicroTec, Keith worked as a process development engineer for both Texas Instruments and Mostek (now ST Microelectronics) in Dallas, Texas.
Kieth holds a bachelor’s degree in Chemical Engineering and a Master of Arts degree.
Ken Mason | Vice President, Sales and Marketing
Ken Mason has enjoyed a rich career of Sales, Marketing, and Executive Management in the Semiconductor industry. Ken's roles at Karl Suss (now Suss Microtec) included Sales, Eastern-US Sales Manager and in 1993 became National Sales Manager. Ken joined Suss x-ray lithography spin-off "SAL" in 1998 as Vice President of Marketing & Sales. After the sale of SAL to JMAR, Ken founded ENCREASE, a company focused on bringing European technology companies forward in US markets. ENCREASE gave birth to SET-NA when Matt Phillips joined the organization in 2008. When not working on DAAHTA's growth, Ken is an independent nanotechnology professional, focused on lithography.
John J. Callahan, Ph.D.
Dr. Callahan is Vice President of Engineering at SemiNex Corporation, a manufacturer of high-power long-wavelength semiconductor lasers. He is responsible for all technical programs including laser design, packaging and system development. Prior to joining SemiNex, Dr. Callahan was Director of Research and Development for Cubic Wafer where he led the efforts to develop a high density (3D-IC) packaging technology for the semiconductor industry. From 2002 to 2005, Dr. Callahan was with Xanoptix, Inc. While there, he served as the Director of Research and Development where he oversaw the IC, Mechanical and Processing Engineering teams. He was responsible for overseeing the development of a high density optical transceiver composed of multiple III-V optoelectronic devices directly bonded to a control ASIC and packaged with coupling optics.
Dr. Callahan earned his Ph.D. from the Georgia Institute of Technology and has multiple patents and publications in the areas of optoelectronic devices, hybridization and device processing.
SET's line of device bonders was formerly a division of SUSS MicroTec until its sale to SET management in 2007. SET North America (SETNA) was formed by several former employees of SUSS MicroTec to sell, service and support SET's device bonders. SETNA is the organizer and sponsor of DAAHTA and is also developing its own line of ancillary equipment to enhance device bonding.
